Indium Corporation will demonstrate precision Au - based chip mount preforms at the International Microwave Symposium

Indium Corporation will demonstrate its highly reliable, Au based precision chip mount (PDA) preform for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium in San Diego, CA, June 11-16.

Indium Corporation is a leading supplier of solders for laser and optical applications. Gold based alloys are an excellent choice to ensure optimal performance and reliability for applications requiring high melting point chip connection solders. In addition to meeting the demanding thermal and electrical requirements of highly reliable applications, they offer the strongest corrosion and oxidation resistance solder joints.

Semiconductor laser chip mounting applications require the highest quality, ultra-precision solder preforms to ensure accuracy and repeatability during assembly, thus ensuring a high degree of reliability in the final product. Indium Corporation's Au Based PDA preforms offer the highest level of quality, providing optimal performance in critical high reliability chip mount applications.

Features include:

Highly accurate thickness control

Precise edge quality, almost burr free

Optimized cleanliness control

Default waffle packing method

Indium Corporation's Au PDA Prefabricated rods are available in the following alloys:

80Au20Sn, 79Au21Sn, 78Au22Sn, 75Au25Sn

88Au12Ge

82Au18In

96.8 Au3.2 Si

Indium Corporation's AuLTRA™ 75 is a metaeutectic AuSn preformed solution (75Au25Sn) designed to improve intermetallic reliability in applications using thicker gold plated chips, For example, GaN chips used in high-frequency, high-power RF power amplifier devices are used in 5G and other important military and aerospace wireless communications. AuLTRA ™ 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition to improve wetting and voids. The AuLTRA™ product line also includes 78Au22Sn and 79Au21Sn components.

Indium Corporation's AuLTRA™ ThInFORMS™ is an 80Au20Sn preform 0.00035 inch thick (0.00889 mm or 8.89 microns) that improves the overall operational efficiency of high output lasers. AuLTRA ™ ThInFORMS ™ helps solve common problems such as:

Short circuit - Reduce the amount of solder to inhibit core absorption and minimize the risk of short circuit

Poor heat transfer -- Ultra-thin 0.00035 "preforms reduce adhesive layer thickness (BLT), which improves heat transfer and increases device life and performance

As a leading gold solder innovator, Indium Corporation's gold-based product portfolio includes wire, paste, prefabricated parts, spheres, balls and strips manufactured with cutting-edge technology to ensure the highest quality and precision. The most commonly used gold-based alloy is 80Au20Sn: a mainstay alloy in the microelectronics industry. With a melting point of 280°C, 80Au20Sn is suitable for most chip connection and lid sealing applications. It exhibits good thermal fatigue properties and is used in many applications requiring high tensile strength and high corrosion resistance.

Source: Laser Net