Laser marking is widely used, and through a highly concentrated laser beam, the laser machine can quickly evaporate and vaporize a part of the material surface, thereby forming identification patterns. Laser marking has advantages such as non deformation, wear resistance, high accuracy, and fast speed, and is widely used in various fields such as food packaging, medical devices, and 3C electronics.
At present, the laser marking machines on the market are mainly small equipment, and the processing machine of these devices generally has a small area or a limited laser head irradiation range. In this case, if you want to process materials beyond the format range, you need to use the splicing marking function. The splicing marking function, as the name suggests, is the ability to divide a large format pattern into different small format areas, and perform laser marking processing in different areas. Finally, these segmented small format areas together form the original large format pattern.
The splicing laser marking control system requires higher requirements in laser control, motion algorithm, stability, and other aspects compared to ordinary laser marking control systems:
Laser control: To ensure the accuracy of the overall processing of laser splicing and marking, parameters such as laser power, pulse frequency, and laser speed must always be consistent when processing different splicing patterns.
Motion algorithm: Adjacent stitching patterns need to be accurately aligned in order for the patterns to appear correctly. This requires a high level of precision from the motion algorithm, and the control system must accurately align every curve at the connection after switching regions.
Stability: When laser splicing and marking processing is carried out in different areas, the controller needs to output a stable and continuous pulse signal. If there is unstable connection or signal error, it will be very obvious in different splicing areas, leading to final processing failure.
Due to the particularity of splicing laser marking, the control system used for splicing laser marking is also different from conventional laser marking control systems. Splicing marking control systems usually use chips with better performance, algorithms with multiple optimization iterations, and circuit designs with more anti-interference capabilities. Therefore, the price of splicing laser marking control systems will be much higher than that of ordinary laser marking control systems.