What is a UV laser cutting machine? It refers to the use of a 355nm wavelength ultraviolet laser, through a 10 times beam expander, through a galvanometer focusing a point to work on the workpiece surface, and through a high-energy beam to instantly vaporize the workpiece surface, forming the purpose of cutting. In addition, an automatic identification and positioning system is installed to realize automatic cutting. The marble working platform is installed to ensure structural stability. The linear motor platform ensures a large processing format to meet industrial needs.
Ultraviolet laser cutting of FPC profile
FPC soft board is an important connection circuit in mobile phone circuit board, which carries the carrier of confidence propagation. It is usually used for the connection between mobile phone battery and circuit board, the connection between camera and circuit board, and the golden finger FPC connection board. The cutting requirements require that the edges be neat, no carbonization, no glue overflow, neat edges, and no burrs. Therefore, the ultraviolet laser cutting machine with cold light source is particularly suitable for cutting FPC shapes. Cut samples as follows:
Ultraviolet laser cutting of brittle glass
Glass is a brittle material, and its strength should be tested after cutting. This requires not only fast cutting speed and neat cutting edges, but also high requirements for the size of its edge collapse. There is no doubt that the ultraviolet laser cutting machine is the most effective way to cut glass, but the ultraviolet laser cutting machine can cut glass with very thin thickness, which is only used in high-end fields temporarily, such as consumer electronics, military industry, etc. Thin glass beyond laser cutting is widely used in mobile phones and military industry due to its fast cutting speed, small edge collapse and neat edges.
Ultraviolet laser cutting of ceramics
As PCB substrate material, ceramic material is a high-end material. Ultraviolet laser ceramic cutting has a wider range of applications, such as heat dissipation substrate, piezoelectric materials, resistors, semiconductor applications, biological applications, etc. In addition to traditional ceramic processing technology, ceramic processing has also entered the laser processing field due to the increase of application types. According to the types of materials, ceramics can be divided into functional ceramics, structural ceramics and biological ceramics. The lasers that can be used to process ceramics include CO2 laser, YAG laser, green laser, etc. However, with the gradual miniaturization of components, ultraviolet laser processing has become a necessary processing method, which can process many kinds of ceramics. The UV laser cutting machine is widely used in soft ceramics and soft hard combined ceramics, with neat cutting edges, fast cutting speed and no carbonization.
Ultraviolet laser wafer cutting. The surface of sapphire substrate is hard. It is difficult to cut it with a general cutter wheel, with high wear, low yield and more than 30 cutting passes μ m. The utility model not only reduces the use area, but also reduces the output of products. Driven by the blue and white LED industry, the demand for sapphire substrate wafer cutting has increased greatly, which puts forward higher requirements for improving productivity and qualified rate of finished products.
Source: Beyond Laser
