As the foundation of modern information technology industry, semiconductor industry has become the basic, strategic and leading industry of social development and national economy, and an indispensable part of modern daily life and future scientific and technological progress; With the gradual progress of global science and technology, the scale of the global semiconductor industry has basically maintained a continuous expansion trend. With the gradual expansion of the scale of the semiconductor industry, the demand for semiconductor manufacturing is growing, and the requirements for semiconductor manufacturing processes are also growing.
1. Evolution of global semiconductor processes
Because laser processing has the advantages of fast processing speed, no direct contact, easy integration, etc., laser technology has gradually penetrated into the semiconductor manufacturing field, aiming at a smaller and more precise micro world, and plays a vital role in chip cutting, marking, micro welding, cleaning, annealing and other processes.
1.1 Laser wafer cutting:
Scribing process is the packaging part of wafer processing, which is a landmark process from wafer level processing to chip level processing. The laser directly acts on the surface of the wafer cutting channel, and the laser energy will be separated from the acted material to achieve the purpose of removal and cutting. At present, laser cutting is divided into two ways: laser invisible cutting and laser ablation cutting. Compared with traditional Chinese culture contact cutter wheel cutting, laser cutting wafer solves the problems of easy edge collapse, slow cutting, and easy to damage the cell surface structure. At the same time, laser technology has also been introduced into the cutting process, which can realize the processing of a chip with smaller diameter.
1.2 Laser marking:
A new type of marking technology without pollution, wear and contact. Laser marking is to use the high-density laser beam to act on the target, so that the target will undergo physical or chemical reaction, so that the target surface will show a visible marking pattern, which solves the problem of semiconductor chip identification. At present, making laser identification code on the chip has become a potential industry standard and a better source of traceability.
1.3 Laser micro welding:
Laser micro welding technology can be used for the welding of small parts and materials, and can be used for precision welding of parts below 2mm. In the design and manufacture of integrated system circuits, laser micro welding technology enterprises can carry out data packaging processing on circuit boards, realize the welding of leads and printed circuits, silicon boards, thin wires and films, and thin wires and integrated control circuits. Compared with the development of traditional welding technology, the advantages of laser micro welding technology enterprises are quite obvious. Not only can we deal with areas that cannot be accessed and treated by other traditional Chinese welding methods, but also can be applied to welding of different materials. In addition, the precision of laser welding points is far better than that of traditional welding methods.
1.4 Laser cleaning:
If the integrated circuit is not properly cleaned in the manufacturing process, the problem of tiny particles polluting materials will affect the efficiency of materials. It is difficult to clean the tiny particles on the surface of the materials with ordinary cleaning methods. There are some limitations in the cleaning effect of both chemical cleaning and ultrasonic cleaning. Laser cleaning has the characteristics of no grinding, non-contact, no thermal effect and is suitable for cleaning objects of different materials in enterprises. It can meet the needs of all kinds of building materials cleaning work in society. It not only has significant effect on removing small particles on the surface of materials, but also can ensure that the template is complete without causing fragmentation. The probability of causing pollution to the learning environment is very low, It can benefit both economic development and environmental protection.
1.5 Laser annealing:
According to the introduction in the article "Application of Laser Annealing Technology in the Semiconductor Field", one of the remarkable features of laser annealing is that the laser with high energy density is irradiated and projected into a small area of the annealed sample in an ultra short period of time, so that the material on the surface of the sample is melted and crystal films are naturally grown in the liquid phase epitaxy of the melted layer during the subsequent cooling process, and the crystal structure of the melted layer is reconstructed; In the process of crystal reconstruction, the lattice damage caused by ion implantation is eliminated, the impurities are diffused and redistributed at high temperatures, and the impurity atoms are dissolved in the crystal and activated to release holes or electrons. At present, laser annealing is mainly applied in three aspects in semiconductor manufacturing, including: annealing the electrodes of semiconductor devices, metallizing to form ohmic contacts; Annealing the connection inside the integrated circuit; Annealing 3D structures, such as memory, NEMS, etc; Among them, ohmic contact is an important part of semiconductor devices. Annealing is a key process for preparing ohmic devices, which plays a role in determining the performance of contact points. At present, with the growing maturity of VLSI manufacturing technology, laser annealing technology has gradually replaced the traditional furnace tube annealing, rapid thermal annealing, peak annealing and flash annealing, becoming a new generation of mainstream annealing technology.
2. "Financing fever" of semiconductor cutting equipment
With the arrival of the equipment localization boom, hot money has poured into the semiconductor equipment market to promote the further development of the industry. According to statistics, since this year, 16 companies have completed a new round of financing in the field of domestic semiconductor equipment, with the amount of financing exceeding 1.7 billion yuan, which is now a popular development direction.
Source: Huagong Laser
