- No hay datos
Español
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
The Helmholtz Dresden Rosendorf Center (HZDR) has made significant progress in laser plasma acceleration. By adopting innovative methods, the research team successfully surpassed previous proton acceleration records significantly.They obtained energy for the first time that can only be achieved in larger facilities so far. As reported by the research team in the journal Nature Physics, promising a...
Professor Zhang Huaijin and Yu Haohai from the Institute of Crystal Materials of Shandong University (the State Key Laboratory of Crystal Materials) proposed a spatial harmonic modulation strategy, which realizes the phase matching conditions that can be manipulated artificially in the new quartz crystal, and realizes the effective frequency doubling within the VUV range. The relevant research is ...
The SCALA 3 LiDAR (Laser Detection and Ranging System), the third generation LiDAR scanner from Valeo, won the "Vehicle Technology and Advanced Mobile Mobility" Innovation Award at the 2024 CES Consumer Electronics Exhibition.The first and second generation Fareo LiDARs SCALA 1 and SCALA 2 have achieved autonomous driving in traffic congestion situations. The third-generation LiDAR SCALA 3 has sig...
Recently, Associate Professor Li Mujun from the School of Engineering Sciences and the Institute of Humanoid Robotics at the University of Science and Technology of China, together with researchers such as Professor Zhang Shiwu, has made significant progress in the field of intelligent material 3D printing. The research team proposed composite cold field 3D printing technology and successfully pre...
In today's technology field, Juguang Technology released two highly anticipated high-power semiconductor lasers on December 13th: GS09 and GA03. These two products are leading the innovation wave in the laser industry with their miniaturized design, excellent thermal management capabilities, and extensive customization flexibility.GS09 revolutionizes chip spacing by compressing the width of the st...