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近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
Recently, SMART Photonics, a Dutch photonic integrated circuit manufacturer, announced a major decision to transfer its entire production capacity from 3-inch wafers to 4-inch silicon substrates, thereby expanding the production scale of photonic chips and significantly reducing chip prices.According to the company, SMART Photonics is one of the first photonic integrated circuit foundries to provi...
Photoacoustic technology provides a non-invasive method for detecting biological tissues, but its clinical application is limited, partly due to the large volume and high cost of laser sources. A compact PA sensing instrument powered by laser diodes for biomedical tissue diagnosis can provide clinical doctors with a practical and effective tool for evaluating breast diseases.By providing a cost-ef...
Researchers from the Massachusetts Institute of Technology and the University of Texas at Austin showcased the first chip based resin 3D printer. Their concept verification tool consists of a millimeter sized photon chip that emits a programmable beam of light into resin holes, which solidify into a solid structure when exposed to light.The prototype processor does not have mobile components, but ...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...