Another blockbuster acquisition! The two equipment makers announced a merger to focus on laser construction

Recently, the Research Group of Nonlinear Photonics Technology and Applications in the State Key Laboratory of Transient Optics and Photonics Technology of Xi'an Institute of Optics and Fine Mechanics has made important progress in the field of super surface nonlinear photonics. Relevant research results were published in the internationally famous journal Nanoscale Horizons. The first author of t...

Recently, American photonics giant Coherent and Japan's Faraday 1867 Holdings signed a Letter of Intent (LOI), with the goal of expanding the manufacturing scale of high-temperature superconducting (HTS) tapes to be widely used in large-scale deployment of nuclear fusion reactors, while also promoting the transformation of green energy. Coherent's excimer laser is expected to be more widely used i...

Lithography is one of the core processes in semiconductor manufacturing, and extreme ultraviolet lithography technology, as a new generation lithography technology, is also in a rapid development stage. The basic principle is to use photoresist (also known as photoresist) to form corrosion resistance due to photochemical reactions after being photosensitive, and to engrave the patterns on the mask...

Recently, the Advanced Laser and Optoelectronic Functional Materials Department of the Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, has made progress in the research of Nd: ASL (Sr0.7Nd0.05La0.25Mg0.3Al22.7O19) laser crystals, and the related achievements were published in Infrared Physics&Technology under the title of "Tunable laser operations on Nd doped cont...

       近日，从江苏通用半导体有限公司传来消息，由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司，并投入生产。 图：8英寸SiC晶锭激光全自动剥离设备       该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片，包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集，一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白，突破了国外的技术封锁，将极大地提升我国碳化硅芯片产业的自主化、产业化水平。       该设备年可剥离碳化硅衬底20000片，实现良率95％以上，与传统的线切割工艺相比，大幅降低了产品损耗，而设备售价仅仅是国外同类产品的1／3。       近年来，碳化硅功率器件在大功率半导体市场中所占的份额不断提高，并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...