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Advanced laser and plasma solution provider E&R Engineering Corp. has confirmed that they will participate in the Semiconductor SEA 2024 event held in Kuala Lumpur, Malaysia. With 30 years of focus in the semiconductor industry, E&R has developed a wide range of plasma and laser technologies. At Semicon SEA 2024, they will showcase their latest solutions, including:Plasma Cutting - Small M...
Recently, Gaota Semiconductor announced the successful development of an advanced 3D imager based on dToF technology for LiDAR applications. The newly developed product FL6031 is based on Tower's 65nm Stacked BSI CIS platform and has pixel level hybrid bonding function. It is the first in a series of products aimed at meeting the needs of numerous deep sensing applications in the automotive, consu...
TDK Corporation (TSE: 6762) announced the introduction of the new NTCWS series of NTC thermistors with gold wire bonding. These bonding NTC thermistors can be installed in packages via gold wire bonding to enable high precision temperature detection of laser diodes (LD) for optical communication. The series will begin mass production in September 2023.The use of LD devices in optical communication...
IntroductionThe small hole mode swing laser welding has gained increasing recognition due to its ability to bridge gaps, refine microstructures, and enhance the mechanical properties of welds. However, the effects of amplitude, frequency, welding speed, laser beam power, and beam radius on heat flux distribution, melting mode, and three-dimensional temperature field have not been well understood. ...
Researchers from the Federal Institute of Technology in Zurich and an American startup used slow curing plastic to develop durable and sturdy robots using high-quality materials.The team can now print these complex robots at once and combine soft, elastic, and rigid materials together. This allows for the creation of precision structures and parts with cavities as needed.Inkbit, a derivative compa...