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Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
Professor Zhang Peilei's team from Shanghai University of Engineering and Technology, in collaboration with the research team from Warwick University and Autuch (Shanghai) Laser Technology Co., Ltd., published a review paper titled "A review of ultra shot pulse laser micromachining of wide bandgap semiconductor materials: SiC and GaN" in the international journal Materials Science in Semiconductor...
Super-resolution fluorescence microscopy surpasses the diffraction limit of what used to be a barrier by using fluorescent probes and specific excitation and emission programs. Most SR technologies heavily rely on image computation and processing to retrieve SR information. However, factors such as fluorescence group photophysics, chemical environment of the sample, and optical settings may cause ...
Renishao collaborated with ASML to meet a range of strict manufacturing and performance requirements and developed a differential interferometer system for providing direct position feedback in metrology applications. Customized encoder solutions can achieve step wise improvements in speed and throughput.Modern semiconductor technology relies on precise control of various processes used in integra...
A team of scientists at the Technical University of Denmark has created a selene-based solar cell by replacing thermal annealing with a new laser annealing strategy."In our work, we investigated the potential of this laser annealing strategy specifically for selenium thin film solar cells, and we report a new world record for fill factor, a new world record for ideal factor, and the most advanced ...