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Recently, Carl Zeiss announced on its official website that it plans to launch a new strategic business unit, ZEISS Photonics&Optics, on October 1, 2024, with the aim of providing excellent optoelectronic and optical products and solutions to global customers. It is reported that starting from the 2024/25 fiscal year, Zeiss Group will establish a new business unit focused on optoelectronics...
In the fields of optics and micro/nano processing, precise manipulation of lasers to meet the growing demand for miniaturization is an important challenge in driving the development of modern electronic and biomedical equipment. Recently, researchers from Tohoku University in Japan successfully demonstrated the use of interference technology to enhance the longitudinal electric field of radially p...
Recently, a joint research team composed of Sun Meizhi, associate researcher of the High Power Laser Physics Joint Laboratory of the Chinese Academy of Sciences Shanghai Institute of Optics and Precision Mechanics, and Tu Xiaoniu, associate researcher of the Chinese Academy of Sciences Shanghai Institute of Silicate, proposed a new configuration of cross Fabry Perot intracavity optical parametric ...
Scientists from the Federal Institute of Technology in Lausanne (EPFL) have successfully miniaturized a powerful erbium-based erbium laser on silicon nitride photonic chips. Due to the large volume and difficulty in shrinking of typical erbium-based fiber lasers, this breakthrough is expected to make significant progress in optical communication and sensing technology.Since the 1960s, lasers have ...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...