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Recently, scientists from the Hanover Laser Center (LZH) in Germany announced the successful development of an automated laser drilling process that can promote the processing of carbon fiber reinforced plastics (CFRP). They stated that this is particularly valuable in applications such as lightweight structures and sound insulation.Composite materials such as carbon fiber reinforced plastics (CFR...
Sivers Semiconductors AB announced that its subsidiary Sivers Photonics has received a new order worth $1 million for advanced optical sensing products from three customers in the fields of LiDAR, Medical, and Industrial.In the first half of the fourth quarter of 2023, new orders were received from several US clients, which will lead to the manufacturing of advanced lasers and optical amplifiers f...
Scientists from the Stanford National Accelerator (SLAC) laboratory of the US Department of Energy have revealed new information about the photoelectric effect using attosecond pulses: the delay time of photoelectric emission is as long as 700 attosecond, far exceeding previous expectations. The latest research challenges existing theoretical models and helps to reveal the interactions between ele...
In a new "Progress in Science" study, scientists from the University of Science and Technology of China have developed a dynamic network structure for neural morphology calculations using laser controlled conductive wires.Neuromorphic computing is an emerging research field that draws inspiration from the human brain to create efficient and intelligent computer systems. The core of neuromorphic co...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...