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Recently, researchers and their partners from the Fraunhofer Institute for Reliability and Microstructure (IZM) in Germany announced the successful development of a laser welding technology that can efficiently fix optical fibers onto photonic integrated circuits (PICs) without the need for adhesive bonding.This technology is developed in response to biophoton sensing technology, mainly utilizing ...
Advanced laser and plasma solution provider E&R Engineering Corp. has confirmed that they will participate in the Semiconductor SEA 2024 event held in Kuala Lumpur, Malaysia. With 30 years of focus in the semiconductor industry, E&R has developed a wide range of plasma and laser technologies. At Semicon SEA 2024, they will showcase their latest solutions, including:Plasma Cutting - Small M...
Aerotech has upgraded the performance of AGV laser scanning heads through powerful controller functions to enhance scanner control (ESC). The new ESC function of the Automation 1-GL4 2-axis laser scanning head driver is a completely passive control loop enhancement function that ensures higher accuracy in the most dynamic motion.With the increasing demand for higher output laser technology in vari...
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Silicon Austria Labs, a leading electronic systems research center in Austria, announced that SAL has received and installed multiple EVG lithography and photoresist processing systems in its MicroFab at the R&D cleanroom facility in Filach, Austria.These devices...
BMW explained how to use WAAM (Arc Additive Manufacturing) starting from 2025 to manufacture lighter and stronger automotive components and reduce waste generation, in order to optimize the use of generative design tools.The demonstrated WAAM process uses aluminum wire raw materials directly deposited through laser welding heads, enabling automotive companies to manufacture lighter and more robust...