Nederlands

SILICON AUSTRIA LABS and EV GROUP Strengthen Cooperation in Optical Technology Research

144
2023-11-15 14:06:51
Bekijk vertaling

EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Silicon Austria Labs, a leading electronic systems research center in Austria, announced that SAL has received and installed multiple EVG lithography and photoresist processing systems in its MicroFab at the R&D cleanroom facility in Filach, Austria.

These devices are part of the strengthened cooperation between the two companies, aimed at accelerating the development and deployment of advanced optical technologies for heterogeneous integrated applications, including wafer level optical devices for micro cameras and mirrors, diffractive optical devices, and automotive optical devices for autonomous driving and automotive lighting.

The newly installed EVG system includes LITHOSCALE maskless exposure system, EVG7300 automated SmartNIL nanoimprinting and wafer level optical system, as well as multiple complementary photoresist processing systems. These systems incorporate multiple existing EVG bonding, mask alignment, and lithography systems from SAL, including the first installation of the next-generation 200mm version of the EVG150 automatic photoresist processing system. Compared to the previous generation platform, this system provides higher throughput, greater flexibility, and smaller tool footprint.

In addition, SAL has been working closely with the technical development and application engineering teams at EVG headquarters, including the NILPhotonics capability center, to leverage EVG's equipment and process knowledge to develop processes that can be transferred and expanded to mass production.

Dr. Mohssen Moridi, Director of Microsystem Research at Silicon Australia Labs, stated: We have recently been immersed in a series of cutting-edge research and development projects, involving metaoptics, integrated photonics, and MEMS, which require the use of advanced lithography and bonding tools. Through our valuable collaboration with EVG, we have obtained tools with excellent reliability and accuracy, which are crucial for successful research and development work. It is worth noting that the EVG7300 SmartNIL system has become a key tool that can be used on a large scale for emerging photonics and MEMS devices Produce nanostructures. Its applications extend to multiple fields such as intelligent lighting systems, AR/VR, automotive optics, telecommunications, and quantum technology.

SAL was one of the first customers to obtain the new EVG7300 system, which is EVG's most advanced solution that combines multiple UV based process capabilities, such as nanoimprint lithography, lens forming, and lens stacking. The EVG7300 is specifically developed to meet the advanced research and production needs of various emerging applications, involving micro and nano patterns as well as functional layer stacking.

EVG's revolutionary LITHOSCALE maskless exposure system meets the lithography needs of markets and applications that require high flexibility or product changes. It solves traditional bottlenecks by combining powerful digital processing capabilities, high structured resolution, and throughput scalability. It is very suitable for rapid prototyping design, providing fast turnaround and development cycle time.

Thomas Glinner, Technical Director of EV Group, stated: Silicon Australia Labs is a leading research center in the field of optical miniaturization and heterogeneous integration, and a strategic partner of EV Group. The latest shipment and installation of our advanced lithography and photoresist processing systems further strengthen our partnership and support SAIC's ability to develop future key technologies and apply our leading solutions to practical industrial applications.

Source: Laser Network

Gerelateerde aanbevelingen
  • Research and investigate the thermal effects of 3D stacked photons and electronic chips

    Hybrid 3D integrated optical transceiver. (A, B) Test setup: Place the photon chip (PIC) on the circuit board (green), and glue the electronic chip (EIC) onto the top of the photon chip. (C) It is the cross-section of the EIC-PIC component with micro protrusions. (D) Display the mesh of the finite element model.The latest progress in artificial intelligence, more specifically, is the pressure plac...

    2023-12-09
    Bekijk vertaling
  • How to choose between continuous and pulsed fiber lasers?

    Fiber laser, with its simple structure, low cost, high electro-optical conversion efficiency, and good output effect, has been increasing in proportion in industrial lasers year by year. According to statistics, fiber lasers accounted for 52.7% of the industrial laser market in 2020.According to the characteristics of the output beam, fiber lasers can be classified into two categories: continuous ...

    2023-12-20
    Bekijk vertaling
  • Photonic hydrogel of high solid cellulose with reconfigurability

    Recently, Qing Guangyan, a researcher team from the Research Group on Bioseparation and Interface Molecular Mechanism (1824 Group) of Biotechnology Research Department of Dalian Institute of Chemical Physics, Chinese Academy of Sciences, designed and prepared a highly solid cellulose photonic hydrogel with reconfigurability and mechanical discoloration. This preparation method opens up a new way t...

    02-17
    Bekijk vertaling
  • The Laser Industry Shines at the Expo, showcasing the country's key weapons and disruptive new products

    The China International Industrial Expo is an important window and economic and trade exchange and cooperation platform for China's industrial sector to the world, as well as a window for the world to understand the current development status of China's manufacturing industry. It is understood that the scale, energy level, and number of new exhibits of this year's Industrial Expo are all the highe...

    2023-09-23
    Bekijk vertaling
  • Mechanism of Time Power Modulation Increasing Weld Depth in High Power Laser Welding

    Researchers from the Hanover Laser Center and Leibniz University in Germany reported on the mechanism of increased welding depth during time power modulation in high-power laser beam welding. The related paper titled "Mechanisms of Increasing Welding Depth during Temporary Power Modulation in High Power Laser Beam Welding" was published in Advanced Engineering Materials.Understanding the basic mec...

    2024-12-18
    Bekijk vertaling