- Geen gegevens
Nederlands
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
The Annual Grand Event for the Laser, Optics, and Optoelectronics Industry in AsiaLASER World of PHOTONICS CHINA20th Anniversary Celebration Coming Soon!📅 March 11-13📍 Shanghai New International Expo Centre (SNIEC), Entrance Hall 3🏢 Halls: N1-N5, E7-E4💡 1,400+ exhibitors across over 100,000 square meters Visitor Opening HoursDay 1: March 11 (Tuesday) 9:00 - 17:00Day 2: March 12 (Wednesday)...
Lithography machine is the key equipment for making high precision mask plate. Using a very fine laser beam, the highly precise line pattern is drawn on the mask substrate under the control of an extremely precise automatic control system.Laser direct writing is to use a laser beam with variable intensity to implement variable dose exposure on the resist material (photoresist) on the subst...
On April 25th, 2024, the Beijing International Auto Show officially opened, and Guangfeng Technology released the world's first ALL-IN-ONE all-around laser headlights.This headlight is the first to integrate multiple functions such as high beam ADB headlights, color changing temperature headlights, fog lights, ground information display, car cinema, etc. into a small volume headlight module, achie...
Recently, relevant information shows that Shenzhen Han's Lithium Battery Intelligent Equipment Co., Ltd. (referred to as Han's Lithium Battery) has won the bid for the solid-state battery pilot line testing section process equipment project and solid-state battery pilot line assembly section process equipment project of Dongfeng Hongtai Holdings Group Co., Ltd. The winning bid amounts are 9.3847 m...
On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...