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Recently, Laserline, a leading semiconductor laser manufacturer in Germany, announced that it has completed the acquisition of a 70% stake in WBC Photonics, a Boston based laser technology expert, marking a significant strategic expansion for Laserline. Through this transaction, Laserline not only expands its product portfolio to include blue laser systems with excellent beam quality (better tha...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...
Zhao Yun/Columbia Engineering Company provided an advanced schematic of a photonic integrated chip, which aims to convert high-frequency signals into low-frequency signals using all optical frequency division.Scientists have built a small all optical device with the lowest microwave noise ever recorded on integrated chips.In order to improve the performance of electronic devices used for global n...
By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
According to the University of Cambridge, researchers have developed a new method for 3D printing metal, which can help reduce costs and more effectively utilize resources. This method, developed by a research team led by the University of Cambridge, allows structural modifications to be "programmed" into metal alloys during 3D printing - fine-tuning their performance without the need for thousand...