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Imagine being able to carry a 3D printer with you and quickly create low-cost objects, such as fastening bicycle wheels or parts needed for critical medical surgeries. Scientists from the Massachusetts Institute of Technology (MIT) and the University of Texas at Austin have combined silicon photonics and photochemical technology to successfully develop the first chip based 3D printer, taking a cru...
Dr. Tan Chaolin from the Singapore Institute of Manufacturing Technology, in collaboration with China University of Petroleum, Shanghai Jiao Tong University, Princeton University, University of Malta, Huazhong University of Science and Technology (Professor Zhang Haiou), University of California, Irvine, Hunan University, and EPM Consulting, published an article titled "Review on Field Assisted Me...
Recently, Professor Tian Zhen's team from Tianjin University has made a breakthrough in the field of photoacoustic remote sensing microscopy technology and successfully developed a new type of non-destructive testing method. This technology uses Kaplin high-power femtosecond laser as the key light source, further optimizing the solution to the internal flaw detection limitations of inverted chips,...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
Recently, the semiconductor industry has adopted Extreme Ultraviolet Lithography (EUVL) technology. This cutting-edge photolithography technology is used for the continuous miniaturization of semiconductor devices to comply with Moore's Law. Extreme ultraviolet lithography (EUVL) has become a key technology that utilizes shorter wavelengths to achieve nanoscale feature sizes with higher accuracy a...