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Researchers have shown that dissipative Kerr solitons (DKS) can be used to create chip based optical frequency combs with sufficient output power for optical atomic clocks and other practical applications. This progress may lead to chip based instruments being able to perform precise measurements that were previously only possible in a few specialized laboratories.Gr é gory Moille from the ...
EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Silicon Austria Labs, a leading electronic systems research center in Austria, announced that SAL has received and installed multiple EVG lithography and photoresist processing systems in its MicroFab at the R&D cleanroom facility in Filach, Austria.These devices...
Polish metal 3D printing company Amazemet uses the Xcelerator software combination from industrial manufacturing company Siemens.The spin off company of Warsaw University of Technology is using Siemens workflow management software to develop its metal powder atomizer and 3D printing post-processing equipment.Amazemet was founded in 2016, and its ultrasonic atomization device is capable of producin...
It is reported that researchers from the Technical University of Munich in Germany have reported a feasibility study on the composite manufacturing of EN AC-42000 alloy by combining laser powder bed melting and cold casting. The related research titled "Feasibility study on hybrid manufacturing combining laser based powder bed fusion and chill casting on the example of EN AC-42000 alloy" was publi...
Laser solder paste is a new type of high-tech laser soldering material that is widely used. Laser solder paste achieves high-precision control of circuit board soldering through laser heating in the electronic manufacturing process. This article will provide a detailed introduction to the working principle of laser solder paste and its applications in fields such as electronic manufacturing and au...