Significant progress made in 808nm high-power semiconductor laser chips

Researchers from Annamarai University in India and South Ural State University in Russia reported a comparative study of resistance spot welding and laser spot welding of ultra-high strength steel for automobiles. The related research was published in The International Journal of Lightweight Materials and Manufacturing under the title "A comparative study on resistance spot and laser beam spot wel...

Recently, a research team from the Korea Institute of Industrial Technology and POSTECH University successfully utilized laser sintering pattern technology to create a deformable micro supercapacitor (MSCs), specifically designed to provide energy storage solutions for soft electronic devices. This breakthrough meets the urgent need for efficient energy storage systems in stretchable devices in...

Recently, Fujitsu and KDDI research company have successfully developed a high-capacity multi band wavelength multiplexing transmission technology using installed optical fibers.The new technology of the two companies can transmit wavelengths beyond the C-band by using batch wavelength conversion and multi band amplification technology.Expanding transmission capacity in remote areasTwo companies h...

Recently, Aerotech Inc., a global leader in precision motion control and automation, launched the HexGen HEX150-125HL miniature hexapod motion platform, a six degree of freedom (DOF) precision positioning system. This compact and cost-effective hexapod sports platform has a base diameter of 150 millimeters and a nominal height of 125 millimeters. It can achieve a minimum incremental movement of up...

       近日，从江苏通用半导体有限公司传来消息，由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司，并投入生产。 图：8英寸SiC晶锭激光全自动剥离设备       该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片，包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集，一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白，突破了国外的技术封锁，将极大地提升我国碳化硅芯片产业的自主化、产业化水平。       该设备年可剥离碳化硅衬底20000片，实现良率95％以上，与传统的线切割工艺相比，大幅降低了产品损耗，而设备售价仅仅是国外同类产品的1／3。       近年来，碳化硅功率器件在大功率半导体市场中所占的份额不断提高，并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...