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The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...
Recently, a team of Professor Ruan Shuangchen and Professor Zhou Cangtao from Shenzhen University of Technology proposed for the first time internationally a physical solution based on the generation of attosecond pulses and subperiodic coherent light shock radiation from a superluminal plasma wake field, and explained a new coherent radiation generation mechanism dominated by collective electron ...
Petrobras announced last week that it plans to use laser beams to measure wind speed and direction. The idea is that these data will be used to improve the operation of the wind turbines maintained by this state-owned company in North Rio Grande do.The total investment of the 2.0 version of this device reaches R $11.3 million, known as the offshore wind assessment remote buoy.This technology can a...
Laser Cladding, also known as laser cladding or laser cladding, is a method of adding cladding material to the surface of the substrate and using a high-energy density laser beam to melt it together with the thin layer on the surface of the substrate. It forms a metallurgical bonded additive cladding layer on the surface of the substrate, which can be used for surface strengthening and defect repa...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...