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On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
The team from the School of Information and Communication Engineering at the University of Electronic Science and Technology of China has proposed for the first time a laser radar instrument based on the dispersion Fourier transform method, forming a new demodulation mechanism. This instrument breaks through the cross limitations of measurement speed, accuracy, and distance, and has unique advanta...
Recently, the research team of Dong Hongxing and Zhang Long from the Research Center of Infrared Optical Materials of the Chinese Academy of Sciences Shanghai Institute of Optics and Precision Mechanics, in cooperation with Huazhong University of Science and Technology, reported a new mechanism for generating dynamically tunable single-mode lasers from exciton polaritons with ultra-low thresholds,...
Recently, Murata Machinery USA, a representative Japanese manufacturer of machinery and CNC machine tools, announced the launch of the latest cutting-edge punch and fiber laser integrated equipment - MF3048HL. This integrated machine combines the advantages of punch operation and laser cutting technology, eliminating the need for separate settings or material transfer between machines.Muratec's pu...
Laser solder paste is a new type of high-tech laser soldering material that is widely used. Laser solder paste achieves high-precision control of circuit board soldering through laser heating in the electronic manufacturing process. This article will provide a detailed introduction to the working principle of laser solder paste and its applications in fields such as electronic manufacturing and au...