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New Product for Wafer Testing Probe Card Manufacturing Equipment Project This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. A...
The development of new energy technology has made battery technology the engine for advancing clean energy. In battery manufacturing, the cutting of battery shell shaped parts is a crucial step. CO2 laser cutting machines have become an innovative tool for promoting the development of this field due to their high efficiency and precision. This article will delve into the important characteristics ...
On September 19th, Hongshan Laser made a stunning appearance at the Shanghai Industrial Expo with multiple flagship products. Among them, the "4+1" fully free heavy-duty groove laser pipe cutting machine TL730S, the 6G fully direct drive laser cutting machine G4020V, and the flagship drilling and attacking integrated laser composite pipe cutting machine TP65SD, represented by three new products, v...
Recently, TSMC held a groundbreaking ceremony for its first European 12 inch wafer fab. It is reported that the European Union has approved Germany to provide 5 billion euros in subsidies for the factory.It is understood that TSMC's 12 inch wafer fab is located in Dresden, Germany and is called "European Semiconductor Manufacturing Company (ESMC)". In August 2023, TSMC announced a partnership with...
LightSolver's new LPU100 system is powered by 100 lasers and can solve the most challenging problems through up to 120100 combinations.This computer was created by Dr. Ruti Ben Shlomi, CEO of LightSolver and Dr. Chen Tradonsky, CTO, a physicist at the Rehowatt Weizmann Institute for Science.It is not suitable for household use because its high computing power exceeds individual needs, but it is su...