High speed direct drive linear module for laser processing and automation

PI, a leading manufacturer of air bearings and precision motion systems, offers two economical families of high performance direct drive linear platform modules, the V-855 and V-857 product families. Direct drive platforms are designed to meet high load and high duty ratio industrial precision motion applications, where traditional actuators driven with lead screw or synchronous belt are deficient in accuracy, robustness and reliability. By utilizing maintenance-free and frictionless high-speed linear motors, these linear motion systems can increase productivity, shorten cycle times and accelerate return on investment. Their superior performance makes them ideal for high-performance applications that require smooth scanning motion, minimal tracking error, and fast stabilization times.

Multi-axis configuration linear module

With a travel range of 200mm to 800mm, its design is easy to configure, allowing for multi-axle assembly as well as compact and medium gantry Settings, all supported by EtherCat based motion controllers.

High resolution linear encoder, high load, fast acceleration

Direct drive linear platform provides high load capacity of up to 220lbs (1000N) and long travel range of up to 32". Integrated linear encoder provides resolution as low as 1 nm. Absolute measurement encoders are also available.

Acceleration is as fast as 5G, with a top speed of 196 inches per second (5 m/s). Due to the no-gap and no-backgap direct drive mechanism, the stability time is very short and the two-way repeatability is excellent.

High performance industrial motion controller based on EtherCAT

PI offers a high-performance industrial motion controller based on EtherCAT -- up to 8 axes can be operated from a 19" rack, and EtherCAT makes adding more axes very easy.

Application field

Laser processing, micromachining and welding, 3D printers, precision industrial automation for electronic assembly of sensors, cameras and optical devices. Metrology and non-contact testing (X - ray and optical). Semiconductor wafer processing and testing.

Source: Laser Net