Researchers have developed an advanced laser water jet machine specifically for automotive semiconductors

Due to the development of electric vehicle technology, the demand for advanced automotive semiconductors is rising. To meet this need, a team of researchers at the Korea Institute of Machinery and Materials (KIMM) has developed a machine that uses laser and water jet technology to process key components of these semiconductors.

Led by researcher Sanghoon Ahn, the team created a laser water knife machine that can efficiently process tough materials such as silicon carbide (SiC). SiC is an important material for automotive semiconductors, but its processing requires specialized machines that used to be imported. However, this new machine can efficiently process silicon carbide, making it easier to cut and process.

A major achievement of the team was the development of a 200W green nanosecond laser, previously only available through imports. They also improved the laser's focusing ability, making it nine times more accurate than before. The design of the machine allows the flow of water to be smooth, with the laser passing through the water, creating a precise cutting process at various points along the flow.

This laser water jet machine combines the speed of a typical laser with the precision of an ultrafast laser, making it extremely efficient. In addition, it collects fine dust and fumes generated during processing to keep the work area clean. Importantly, the machine is also more affordable, costing 20 percent less than imported machines.

The development of this laser water jet will help strengthen the future semiconductor equipment industry in South Korea and enhance the competitiveness of the entire semiconductor industry. It also supports efforts by South Korean companies to gain market share. The research was conducted under the auspices of the Ministry of Trade, Industry and Energy's Difficult-cutting Materials Laser Mixer development project.

Source: Laser Network