1. It is not impossible to drill holes on the solder pad. If you are willing to spend money on small holes, the laser hole and plugging process should be fine;
a. For BGA pads with a spacing of less than or equal to 0.5mm, they must be very dense and holes must be drilled on the pads; The difficulty and cost of PCB plate making process have increased;
b. For some QFN and other packaged central pads and grounding pads, it is necessary to drill, and the through-hole should not be too large. Reflux and peaks are allowed;
c. In RF applications, it is common to have through holes on the solder pads of devices such as resistors and capacitors;
d. It is common to place through holes on the solder pads of some high-speed devices.
2. In general, manual soldering is not a problem, and reflow soldering should not be used. After the solder flows into the hole, there is too little solder on the solder pad, which can easily cause virtual soldering;
For small resistive and capacitive components, it may cause one end to tilt up, commonly known as the phenomenon of vertical monuments.
