Five methods for adjusting the marking depth of laser marking machines

During the operation process, selecting different parameters and materials for marking workpieces can affect the marking depth of the laser marking machine, sometimes leading to shallow or deep marking effects. In fact, the marking depth of the laser marking machine can be adjusted to a certain extent. Here are five methods to adjust the marking depth:

1. Increasing laser power can directly increase the depth of laser marking, but the prerequisite for increasing power is to ensure the laser power supply. Laser chillers, laser lenses, etc. also need to be matched with them, and the performance of their related accessories must withstand the efficiency after power improvement. Therefore, sometimes it is necessary to temporarily replace the accessories, but the cost will increase, and the workload or technical requirements will increase.

2. Replacing with better laser marking accessories, such as using imported Q-switches for laser marking in semiconductor machines, will result in better marking depth.

3. Transforming the field mirror of the laser marking machine into a small-scale field mirror, the depth of marking will also be deeper. For example, current semiconductor laser marking machines can be equipped with a field mirror of 110, which has been transformed into a field mirror of 50. The total laser energy and engraving depth will be about twice as high as before.

4. If the laser mode of the laser marking machine is improved, its marking depth will also be improved to a certain extent. For example, in semiconductor laser marking, adding small holes can increase cooling accuracy, adjusting the laser mode to emit light, making the laser larger, rounder, and brighter.

5. Slow down the marking speed of the laser marking machine. Under the same power and other parameters, if only the marking speed is modified, the marking depth will naturally be deeper.