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Hybrid 3D integrated optical transceiver. (A, B) Test setup: Place the photon chip (PIC) on the circuit board (green), and glue the electronic chip (EIC) onto the top of the photon chip. (C) It is the cross-section of the EIC-PIC component with micro protrusions. (D) Display the mesh of the finite element model.The latest progress in artificial intelligence, more specifically, is the pressure plac...
The rapid development of photonic integrated circuits (PICs) has combined multiple optical devices and functions on a single chip, completely changing optical communication and computing systems.For decades, silicon-based PICs have dominated the field due to their cost-effectiveness and integration with existing semiconductor manufacturing technologies, despite their limitations in electro-optic ...
In the past decade, metal 3D printing technology has experienced rapid development, from the initial production of orthopedic implants to the manufacturing of rocket boosters. This technology has become an indispensable part of multiple key industries. With the advancement of technology and the expansion of the market, we are witnessing the revival of electron beam melting (EBM) technology and the...
The National Institute of Information and Communication Technology of Japan, Nagoya Institute of Technology, and Japan Aerospace Exploration Agency have achieved the so-called "world's first successful demonstration of next-generation error correction codes, reducing the impact of atmospheric turbulence on ground to satellite laser communication".Atmospheric turbulence in ground-to-satellite laser...
Chinese industrial 3D printer manufacturer Huashu High tech has launched the FS811M metal powder bed fusion series platform. The FS811M series has a construction volume of 840 x 840 x 960 millimeters and can be equipped with powerful 6, 8, 10, or 12 x 500 watt fiber lasers."As the latest member of the Huashu High tech Metal 3D printer product portfolio, FS811M originates from our joint innovation ...