chanelink logo
CHANELINK
English

SEI and Matik showcase the latest laser technology at a joint printing exhibition

1207
2023-10-17 14:07:38
See translation

SEI Laser, a leading manufacturer of laser cutting systems, and its North American distributor Matik, Inc. will showcase SEI Laser's three most popular machines at the upcoming Joint Printing Expo. Visit booth C2811 on the C floor of the Joint Printing Expo to watch live demonstrations of MERCURY, X-TYPE, and Labelmaster.

MERCURY is the ideal choice for cutting everything from paper and cardboard to textiles and wood. The X-TYPE plotter laser system is currently the fastest and most high-performance system.

Label Master is the perfect solution to meet all your label conversion needs. It is fast, precise, and versatile, while also capable of processing various materials. SEI has also launched KyoJet, a new digital high-resolution inkjet UV online module. The KyoJet integrated with Labelmaster is the only one-way machine that can provide labels from PDF and printing to binding and preparation for shipment.

Check out the latest and most advanced laser technology at the Matik and SEI Laser booths. Bring your files for on-site demonstration and discover the functionality to automate the production process. Learn how to take your business to a new level in printing collaboration.

Source: Laser Network

Related Recommendations

  • More evidence of cosmic gravitational wave background: Laser interferometer gravitational wave observatory composed of two detectors

    The gravitational wave background was first detected in 2016. This was announced after the release of the first dataset by the European pulsar timing array. The second set of data has just been released, combined with the timed array of Indian pulsars, and both studies have confirmed the existence of the background. The latest theory seems to suggest that we are seeing a comprehensive signal of th...

    2024-05-21
    See translation

  • Research and investigate the thermal effects of 3D stacked photons and electronic chips

    Hybrid 3D integrated optical transceiver. (A, B) Test setup: Place the photon chip (PIC) on the circuit board (green), and glue the electronic chip (EIC) onto the top of the photon chip. (C) It is the cross-section of the EIC-PIC component with micro protrusions. (D) Display the mesh of the finite element model.The latest progress in artificial intelligence, more specifically, is the pressure plac...

    2023-12-09
    See translation

  • HGTECH Laser's New Product Debuts at the 2025 Munich Shanghai Light Expo

    New Product for Wafer Testing Probe Card Manufacturing Equipment Project This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. A...

    03-07
    See translation

  • Magdalena Ridge expands the capacity of optical interferometers

    The Magdalena Ridge Observatory has purchased a second-generation off-axis beam compressor from Optical Surface, which will expand the functionality of the facility's optical interferometer.Interferometer is a research tool that combines two or more light sources to create interference patterns that can be measured and analyzed. In astronomy, interferometers combine the light collected by multiple...

    2024-01-05
    See translation

  • The technological iteration route of automotive millimeter wave radar chips

    The rapid development of intelligent cars and autonomous driving technology has made millimeter wave radar inconspicuous, and the widespread application of millimeter wave radar has driven the technological evolution of MMIC.From the expensive gallium arsenide (GaAs) process in the early days to the mainstream CMOS and SiGe processes today, and then to the future promising FD-SOI process, the cont...

    2024-12-07
    See translation