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Recently, HieFo, a leading enterprise in the field of optical communication, officially launched its HCL30 DFB laser chip, designed specifically to meet the stringent requirements of coherent optical transmission. This chip combines efficient optical output power with excellent narrow linewidth performance, providing multiple industry standard wavelength options in the O-band and C-band, bringin...
It is reported that researchers from the Technical University of Munich in Germany have reported a feasibility study on the composite manufacturing of EN AC-42000 alloy by combining laser powder bed melting and cold casting. The related research titled "Feasibility study on hybrid manufacturing combining laser based powder bed fusion and chill casting on the example of EN AC-42000 alloy" was publi...
Chip giant Intel announced that it has completed the assembly work of the world's first commercial high numerical aperture (NA) extreme ultraviolet lithography (EUV) scanner. This device greatly improves the resolution and feature scaling of next-generation chips by changing the optical design used to project printed images onto silicon wafers.This lithography equipment weighing 150 tons has been ...
In the field of optoelectronics, researchers from Busan National University in South Korea and the University of Oxford in the UK have successfully improved the signal amplification ability of CsPbBr3 perovskite nanosheets through innovative patterned waveguide methods, bringing new possibilities for the future of optoelectronics. This breakthrough not only has potential applications in fields suc...
Laudado&Associates LLC (L&A), an agricultural technology development company headquartered in California, announced the Autonomous Agricultural Solutions Conference held at FIRA Robotics&last week in Salinas, California.This patent pending technology is a completely new design, designed by L&A, aimed at maximizing the commercial feasibility of laser weeding and thinning. It utilize...