English

The University of California has developed a pioneering chip that can simultaneously carry lasers and photonic waveguides

1051
2023-08-10 18:28:38
See translation

A team of computer and electrical engineers at UC Santa Barbara, in collaboration with several colleagues at Caltech and another colleague at Anello Photonics, has developed a first-of-its-kind chip that can carry both laser and photonic waveguides. In a paper published in the journal Nature, the team describes how they made the chip and how it worked during testing.

With the advent of integrated circuits, scientists learned to place transistors, diodes, and other components on a single chip, greatly increasing their potential. In the past few years, researchers working on photonics have hoped to achieve the same feat. People in the field say that the development of similar photonic chips could lead to more precise experiments with atomic clocks and could also be used for quantum applications. It will also reduce the need for huge optical platforms.

In order for such a chip to work, it must house both the laser and the photon waveguide. For this purpose, engineers have developed plug-in isolators to prevent reflections and thus avoid instability in the absence of plug-in isolators. Unfortunately, this method requires the use of magnetism, which causes problems in production. In this new effort, the research team found a way to overcome these problems and create the first truly usable composite chip.

To make the chip, the researchers first placed ultra-low loss silicon nitride waveguides on a silicon substrate. They then covered the waveguide with a variety of silicon and installed a low-noise indium phosphate laser on the waveguide. By separating the two components, the team prevented damage to the waveguide during etching.

The team notes that separating the two components also requires the use of a redistribution layer made of silicon nitride to allow interaction between the two components via the evanescent field. The distance formed by the silicon layer between the two components minimizes interference.

The researchers first measured its noise levels to test their chip. They found they were satisfied and then used it to create a tunable microwave frequency generator. They describe their chip as "a critical step toward complex systems and networks on silicon."

Source: Laser Network

Related Recommendations
  • Scientists from the SLAC National Accelerator Laboratory in the United States have launched the world's most powerful X-ray laser

    Scientists at the SLAC National Accelerator Laboratory have launched the world's most powerful X-ray laser, which will be used for in-depth atomic and molecular research.It is a significant upgrade to its predecessor, as its brightness has increased by 10000 times.The upgraded laser facility also uses superconducting accelerator components, allowing it to operate at low temperatures near absolute ...

    2023-11-17
    See translation
  • German team develops and promotes laser technology for formable hybrid components

    Scientists from the Hanover Laser Center (LZH) in Germany are studying two laser based processes for producing load adapted hybrid solid components.From a transaction perspective, mixing semi-finished products can help save materials and production costs, but if the components that need to be replaced are made of expensive materials, these materials need to meet high requirements in future use, su...

    2023-08-16
    See translation
  • Which automotive parts can use laser soldering technology

    Laser soldering is widely used in the manufacturing of automotive parts. Here are some common automotive parts that can be welded using laser soldering:Automotive electronic control systemEngine Control Unit (ECU): The engine control unit is the "brain" of the car engine, which receives signals from various sensors and controls the operation of the engine based on these signals. Laser soldering ca...

    02-10
    See translation
  • Development, Share, and Industry Insights of the US Laser Processing Market in 2025

    The global laser processing market is expected to grow from $4.2 billion in 2023 to $7.73 billion in 2031, with a compound annual growth rate (CAGR) expected to reach 8.1% during this forecast period. According to DataM Intelligence Comprehensive Report has released its latest report on the "Laser Processing Market Size 2025," providing a detailed analysis of market trends, key growth drivers, c...

    11-13
    See translation
  • Turn to 4-inch wafers! Dutch Photonics Integrated Circuit Enterprise Announces Production Expansion and Price Reduction

    Recently, SMART Photonics, a Dutch photonic integrated circuit manufacturer, announced a major decision to transfer its entire production capacity from 3-inch wafers to 4-inch silicon substrates, thereby expanding the production scale of photonic chips and significantly reducing chip prices.According to the company, SMART Photonics is one of the first photonic integrated circuit foundries to provi...

    2024-02-03
    See translation