English

The University of California has developed a pioneering chip that can simultaneously carry lasers and photonic waveguides

1154
2023-08-10 18:28:38
See translation

A team of computer and electrical engineers at UC Santa Barbara, in collaboration with several colleagues at Caltech and another colleague at Anello Photonics, has developed a first-of-its-kind chip that can carry both laser and photonic waveguides. In a paper published in the journal Nature, the team describes how they made the chip and how it worked during testing.

With the advent of integrated circuits, scientists learned to place transistors, diodes, and other components on a single chip, greatly increasing their potential. In the past few years, researchers working on photonics have hoped to achieve the same feat. People in the field say that the development of similar photonic chips could lead to more precise experiments with atomic clocks and could also be used for quantum applications. It will also reduce the need for huge optical platforms.

In order for such a chip to work, it must house both the laser and the photon waveguide. For this purpose, engineers have developed plug-in isolators to prevent reflections and thus avoid instability in the absence of plug-in isolators. Unfortunately, this method requires the use of magnetism, which causes problems in production. In this new effort, the research team found a way to overcome these problems and create the first truly usable composite chip.

To make the chip, the researchers first placed ultra-low loss silicon nitride waveguides on a silicon substrate. They then covered the waveguide with a variety of silicon and installed a low-noise indium phosphate laser on the waveguide. By separating the two components, the team prevented damage to the waveguide during etching.

The team notes that separating the two components also requires the use of a redistribution layer made of silicon nitride to allow interaction between the two components via the evanescent field. The distance formed by the silicon layer between the two components minimizes interference.

The researchers first measured its noise levels to test their chip. They found they were satisfied and then used it to create a tunable microwave frequency generator. They describe their chip as "a critical step toward complex systems and networks on silicon."

Source: Laser Network

Related Recommendations
  • The globalization of three-color laser technology will be further accelerated

    Recently, the IFA2023 Consumer Electronics Show in Berlin, Germany opened, Hisense exhibited "three-color laser projection family bucket" attracted the attention of media and tourists from all over the world.Since Hisense's young fashion brand Vidda launched a series of three-color laser projection, its accumulation based on three-color laser technology is competing globally and has become a...

    2023-09-04
    See translation
  • Ireland's first biological Brillouin microscope at Trinity College Dublin

    A project at Trinity College Dublin is now hosting Ireland's first BioBrillouin microscope instrument, applying Brillouin spectroscopy to life sciences and medicine.This should in particular enhance the College's research into cellular and tissue mechanics for the study of inflammation, cancer, and developmental biology.Brillouin microscopy offers a route to optical investigation of a biological s...

    07-14
    See translation
  • The First Operation of Two Color Mode in Infrared Free Electron Laser

    The Fritz Haber Institute of the Max Planck Institute in Berlin has achieved a technological milestone. The infrared free electron laser operates in dual color mode for the first time. This globally unique technology makes it possible to conduct experiments on synchronous dual color laser pulses, opening up new possibilities for research.There are over a dozen free electron lasers worldwide, with ...

    2024-02-18
    See translation
  • TRUMPF machine cooler saves 50 percent energy

    Ditzingen, 05. March 2025 – At its in-house exhibition INTECH, high-tech company TRUMPF is showcasing a new cooler for its laser cutting machines. The new unit is capable of reducing energy consumed during the cooling process and uses fifty percent less energy than conventional solutions. Unlike conventional coolers, the main components of this new solution— such as pumps, fans and compressors— ar...

    03-14
    See translation
  • Hymson acquires Leister Laser's plastic welding business, further advancing its globalization strategy

    On February 27th, Hymson and Leister Group successfully signed a strategic acquisition agreement, announcing the wholly-owned acquisition of the laser plastic welding business of Leister Group.On the same day, the two parties held a grand signing ceremony in Switzerland, which was attended by Mr. Zhao Shengyu, Chairman and General Manager of Hymson, Mr. Chen Jiewei, Director and CEO of Hymson, Mr....

    03-11
    See translation