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Hybrid 3D integrated optical transceiver. (A, B) Test setup: Place the photon chip (PIC) on the circuit board (green), and glue the electronic chip (EIC) onto the top of the photon chip. (C) It is the cross-section of the EIC-PIC component with micro protrusions. (D) Display the mesh of the finite element model.The latest progress in artificial intelligence, more specifically, is the pressure plac...
Recently, a research team from the University of Massachusetts Amherst has pioneered a new technology that uses laser irradiation on concentric superlenses on chips to generate holograms, thereby achieving precise alignment of 3D semiconductor chips.This research result, published in the journal Nature Communications, is expected to not only reduce the production cost of 2D semiconductor chips, bu...
Recently, Professor Tian Zhen's team from Tianjin University has made a breakthrough in the field of photoacoustic remote sensing microscopy technology and successfully developed a new type of non-destructive testing method. This technology uses Kaplin high-power femtosecond laser as the key light source, further optimizing the solution to the internal flaw detection limitations of inverted chips,...
Fiber optic solution provider Eurotech announced the launch of a series of fiber optic rack mounting enclosures. The BestNet 19 inch top opening fiber optic interconnect unit is a fiber optic patch panel and cabinet, ideal for wiring, terminating, and managing fiber optic terminations, suitable for interconnect, cross connect, or splice applications in LAN environments. Modular fiber optic interco...
One vision for computing the future is to use ripples in magnetic fields as the fundamental mechanism. In this application, magnetic oscillators can be comparable to electricity and serve as the foundation of electronic products.In traditional digital technology, this magnetic system is expected to be much faster than today's technology, from laptops and smartphones to telecommunications. In quant...