Gas reduction technology of fiber laser helps to improve the cutting quality of low-carbon steel

Recently, BLM GROUP USA, a leading manufacturer of laser tube and sheet metal processing equipment, announced that its North American headquarters in Novi, Michigan has officially started construction, with plans to add 65000 square feet of modern facilities. It is expected to be completed and put into use in the third quarter of 2025.The specific investment amount for this expansion has not been ...

Multi photon 3D laser printing technology, as a disruptive micro manufacturing technology, is facing two major challenges: speed and material compatibility. However, the latest research has made breakthrough progress, successfully increasing printing speed tenfold while maintaining excellent detail accuracy.In this remarkable study, scientists abandoned the traditional single beam printing method ...

Petrobras announced last week that it plans to use laser beams to measure wind speed and direction. The idea is that these data will be used to improve the operation of the wind turbines maintained by this state-owned company in North Rio Grande do.The total investment of the 2.0 version of this device reaches R $11.3 million, known as the offshore wind assessment remote buoy.This technology can a...

IntroductionThe small hole mode swing laser welding has gained increasing recognition due to its ability to bridge gaps, refine microstructures, and enhance the mechanical properties of welds. However, the effects of amplitude, frequency, welding speed, laser beam power, and beam radius on heat flux distribution, melting mode, and three-dimensional temperature field have not been well understood. ...

       近日，从江苏通用半导体有限公司传来消息，由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司，并投入生产。 图：8英寸SiC晶锭激光全自动剥离设备       该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片，包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集，一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白，突破了国外的技术封锁，将极大地提升我国碳化硅芯片产业的自主化、产业化水平。       该设备年可剥离碳化硅衬底20000片，实现良率95％以上，与传统的线切割工艺相比，大幅降低了产品损耗，而设备售价仅仅是国外同类产品的1／3。       近年来，碳化硅功率器件在大功率半导体市场中所占的份额不断提高，并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...