- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
Recently, SMART Photonics, a Dutch photonic integrated circuit manufacturer, announced a major decision to transfer its entire production capacity from 3-inch wafers to 4-inch silicon substrates, thereby expanding the production scale of photonic chips and significantly reducing chip prices.According to the company, SMART Photonics is one of the first photonic integrated circuit foundries to provi...
According to a latest overseas market research report, it is expected that the global industrial laser system market size will reach approximately 32.2 billion US dollars by 2028, with a compound annual growth rate of 8.3% from 2023 to 2028.The future prospects of the global industrial laser system market are broad, with opportunities in numerous fields such as semiconductors and electronics, auto...
According to Korean media reports, Meere, a semiconductor and display equipment manufacturer from South Korea, is continuously expanding its presence in the high stack semiconductor market, including its HBM business.In fact, Meere itself is the world's top manufacturer of display edge grinding mechanisms, with a market share of up to 70%. It is based on its accumulation of display microfabricatio...
In the future, electric vehicle battery manufacturers can further improve the durability and performance of electric vehicle batteries through compact X-ray sources. The XProLas development partnership has now begun to develop these laser driven X-ray sources under the leadership of TRUMPF. The first batch of demonstration systems will be completed in 2026. In the future, manufacturers will be abl...
Recently, researchers and their partners from the Fraunhofer Institute for Reliability and Microstructure (IZM) in Germany announced the successful development of a laser welding technology that can efficiently fix optical fibers onto photonic integrated circuits (PICs) without the need for adhesive bonding.This technology is developed in response to biophoton sensing technology, mainly utilizing ...