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Recently, Gaota Semiconductor announced the successful development of an advanced 3D imager based on dToF technology for LiDAR applications. The newly developed product FL6031 is based on Tower's 65nm Stacked BSI CIS platform and has pixel level hybrid bonding function. It is the first in a series of products aimed at meeting the needs of numerous deep sensing applications in the automotive, consu...
It was learned from the University of Science and Technology of China that the team of Professor Wu Dong of the Micro and Nano Engineering Laboratory of the school proposed a femtosecond laser two-in-one multi-material processing strategy, manufactured a micromechanical joint composed of temperature-sensitive hydrogel and metal nanoparticles, and then developed a multi-joint humanoid micromachine ...
Recently, NUBURU, a global developer of high-power and high brightness industrial blue light laser technology, announced the signing of a strategic commitment letter, officially launching a deep layout in the field of national defense and security. This transformation plan covers capital restructuring, technology mergers and acquisitions, and management team upgrades, marking a new stage of divers...
EV Group, a leading supplier of wafer bonding and lithography equipment in the MEMS, nanotechnology, and semiconductor markets, yesterday launched the EVG850 NanoClean layer release system, which is the first product platform to adopt EVG's revolutionary NanoClean technology.The EVG850 NanoClean system combines infrared lasers with specially formulated inorganic release materials, and can ...
New Product for Wafer Testing Probe Card Manufacturing Equipment Project This project adopts vision guided laser precision cutting to separate the probe from the crystal disk, and then generate a product mapping image for use in the next process. When picking up the probe, multi-point reference surface fitting technology is used to achieve non-contact probe suction and avoid force deformation. A...