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By using a new type of laser, the processing speed of wafers can be 10 to 20 times faster than before. This is the result of a research project at the Fraunhofer Institute for Solar Systems in Germany.Researchers have developed a prototype that can use ultraviolet waves to carve the most intricate structures on silicon wafers. The new system concept enables solar cell manufacturers to perform lase...
Scientists at the University of Chicago have demonstrated a way to create infrared light using colloidal quantum dots. The researchers say this approach shows great promise; Although the experiment is still in its early stages, these quantum dots are already as efficient as existing conventional methods.These points could one day form the basis of infrared lasers, as well as small and inexpensive ...
The National Science Foundation (NSF) of the United States has awarded the University of Rochester nearly $18 million for three years to design and prototype key technologies for EP-OPAL, a new facility dedicated to studying the interaction between ultra-high intensity lasers and matter.After the design project is completed, the facility can be built at the Laser Energy Laboratory (LLE). This fund...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. After the announcement, DIT's stock price rose for five consecutive days, entering the 16000 Korean won range. Then on the 22nd, it rose 2580 Korean won from the previous day'...
Recently, the reporter learned from Changguang Satellite Technology Co., Ltd. (hereinafter referred to as "Changguang Satellite") that the company used a self-developed vehicle mounted laser communication ground station to conduct satellite ground laser high-speed image transmission experiments with the onboard laser communication terminal of the "Jilin No.1" constellation MF02A04 satellite and ac...