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A group of network, semiconductor, and optical companies formed the LPO MSA to develop the network equipment and optical module specifications required to implement a wide ecosystem of interoperable LPO solutions.These specifications address the industry challenges of reducing power consumption, cost, and latency while improving the reliability of high-speed optical interconnections.Accelink, AMD...
March 8, in the three sessions of the 14th National People's Congress, the second “representative channel” focused on interviews, the National People's Congress, the party secretary of HGTECH Science and Technology, Chairman of the Board of Directors Ma Xinqiang, said in response to a reporter's question, in order to crack the “strangle “technical problems, HGTECH over the years in the field of h...
Researchers from the Massachusetts Institute of Technology and the University of Texas at Austin showcased the first chip based resin 3D printer. Their concept verification tool consists of a millimeter sized photon chip that emits a programmable beam of light into resin holes, which solidify into a solid structure when exposed to light.The prototype processor does not have mobile components, but ...
The fully dielectric element surface has the characteristics of low material loss and strong field localization, making it very suitable for manipulating electromagnetic waves at the nanoscale. Especially the surface of all silicon dielectric elements can achieve ideal compatibility with complementary metal oxide semiconductor technology, making it an ideal choice for large-scale monolithic integr...
Recently, a team of Professor Ruan Shuangchen and Professor Zhou Cangtao from Shenzhen University of Technology proposed for the first time internationally a physical solution based on the generation of attosecond pulses and subperiodic coherent light shock radiation from a superluminal plasma wake field, and explained a new coherent radiation generation mechanism dominated by collective electron ...