- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
TDK Corporation (TSE: 6762) announced the introduction of the new NTCWS series of NTC thermistors with gold wire bonding. These bonding NTC thermistors can be installed in packages via gold wire bonding to enable high precision temperature detection of laser diodes (LD) for optical communication. The series will begin mass production in September 2023.The use of LD devices in optical communication...
Nikon Vision, a subsidiary of Nikon Corporation, is pleased to announce the launch of the COOLSHOT 20i GIII laser rangefinder for golfers, which is Nikon's small and lightweight model in the COOLSHOT series.While maintaining the lightweight and compact size of the COOLSHOT 20i GII, the new model notifies users through brief vibrations that the distance to the flagpole has been measured.When measur...
The rapid development of photonic integrated circuits (PICs) has combined multiple optical devices and functions on a single chip, completely changing optical communication and computing systems.For decades, silicon-based PICs have dominated the field due to their cost-effectiveness and integration with existing semiconductor manufacturing technologies, despite their limitations in electro-optic ...
Imagine soaring above the Earth, the world unfolds in patterns and reliefs, and the terrain whispers its secrets in the wind. Now imagine capturing these whispers and translating them into a digital language to draw our world map with unprecedented accuracy. Welcome to the forefront of laser scanning drones, a technological ballet in the sky where the fusion of flight and laser precision is reshap...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...