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Recently, EO Technologies, a well-known semiconductor laser processing equipment manufacturer in South Korea, is emerging in the glass substrate processing market.It is understood that EO Technologies is entering the glass substrate TGV market based on its UV laser drilling equipment originally used in PCB substrate technology. TGV technology is the core process for drilling holes inside glass sub...
According to the University of Cambridge, researchers have developed a new method for 3D printing metal, which can help reduce costs and more effectively utilize resources. This method, developed by a research team led by the University of Cambridge, allows structural modifications to be "programmed" into metal alloys during 3D printing - fine-tuning their performance without the need for thousand...
TriLite has announced a technical collaboration with ams OSRAM, a global leader in smart sensors and transmitters. Ams Osram will supply its sub-assembled RGB laser diode to "light up" TriLite's Trixel® 3 laser beam scanner (LBS), the world's smallest AR smart glasses projection display.The award-winning Trixel® 3 LBS offers breakthrough compactness and light weight, as well as a bright an...
It is reported that the National Institutes of Sciences (INRS) of Canada has developed a camera platform that can achieve cheaper ultra fast imaging through the use of ready-made components, which can be used in various applications.This new device aims to address some of the limitations of current high-speed imaging, including parallax errors and potential damage from pulse illumination. Th...
In the fields of optics and micro/nano processing, precise manipulation of lasers to meet the growing demand for miniaturization is an important challenge in driving the development of modern electronic and biomedical equipment. Recently, researchers from Tohoku University in Japan successfully demonstrated the use of interference technology to enhance the longitudinal electric field of radially p...