- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
The related paper was published in Heliyon under the title "A systematic review of Inconel 939 alloy parts development via additive manufacturing process".IN939 is a modern nickel based high-temperature alloy that can work continuously at high temperatures due to its excellent fatigue resistance, creep resistance, and corrosion resistance. The unique performance of IN939 is related to the composit...
The Helmholtz Dresden Rosendorf Center (HZDR) has made significant progress in laser plasma acceleration. By adopting innovative methods, the research team successfully surpassed previous proton acceleration records significantly.They obtained energy for the first time that can only be achieved in larger facilities so far. As reported by the research team in the journal Nature Physics, promising a...
Polytetrafluoroethylene (PTFE) has improved the efficiency and repeatability of nanosecond and picosecond laser processing technologies used in microelectronics and display glass manufacturing. In the field of precision manufacturing, the demand for efficient and repeatable processes is crucial. The laser structure of glass and laser ablation of silicon substrates are key areas where precision p...
Recently, the Advanced Laser and Optoelectronic Functional Materials Department of the Shanghai Institute of Optics and Precision Mechanics, Chinese Academy of Sciences, has made new progress in the corrosion mechanism of alkali aluminophosphate glass. The research findings were published in The Journal of Physical Chemistry C under the title "Formation Mechanism of Crystal Phase during Corrosion ...
Recently, EO Technologies, a well-known semiconductor laser processing equipment manufacturer in South Korea, is emerging in the glass substrate processing market.It is understood that EO Technologies is entering the glass substrate TGV market based on its UV laser drilling equipment originally used in PCB substrate technology. TGV technology is the core process for drilling holes inside glass sub...