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On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
Recently, Gaota Semiconductor announced the successful development of an advanced 3D imager based on dToF technology for LiDAR applications. The newly developed product FL6031 is based on Tower's 65nm Stacked BSI CIS platform and has pixel level hybrid bonding function. It is the first in a series of products aimed at meeting the needs of numerous deep sensing applications in the automotive, consu...
In a new "Progress in Science" study, scientists from the University of Science and Technology of China have developed a dynamic network structure for neural morphology calculations using laser controlled conductive wires.Neuromorphic computing is an emerging research field that draws inspiration from the human brain to create efficient and intelligent computer systems. The core of neuromorphic co...
On December 11th local time, New York State announced a partnership with companies such as IBM, Micron, Applied Materials, and Tokyo Electronics to jointly invest $10 billion to expand the Albany NanoTech Complex in New York State, ultimately transforming it into a high numerical aperture extreme ultraviolet (NA EUV) lithography center to support the development of the world's most complex and pow...
Recently, Zhang Xin's research team from the Institute of Oceanography, Chinese Academy of Sciences, based on the in-situ laser Raman spectroscopy technology, made new progress in the in-situ recognition and quantification of methane carbon isotopes by using the significant differences in the Raman spectra of methane carbon isotopes (13CH4 and 12CH4). The relevant results were recently published i...