English

Teledyne Technologies acquires a portion of its optoelectronic business

1432
2024-11-12 10:51:47
See translation

Recently, Teledyne Technologies announced that it has reached an agreement to acquire a portion of Excelitas Technologies' aerospace and defense electronics business for $710 million in cash.

This acquisition includes the optical systems business under the Qioptiq brand headquartered in North Wales, UK, as well as the Advanced Electronic Systems (AES) business headquartered in the United States.

It is understood that the optical systems business headquartered in the UK provides advanced optical components for head up displays, helmet displays, and tactical night vision systems under armor, as well as proprietary glass for space and satellite applications. In the United States, AES provides customized energy components for defense and space applications, including electronic security and arm devices, high-voltage semiconductor switches, and rubidium atomic frequency standards. This transaction is expected to be completed in early 2025 and is subject to meeting standard closing conditions, including obtaining regulatory approval.

Teledyne Technologies is a leading supplier of precision electronic equipment, auxiliary systems, instruments, and communication devices. Founded in 1960, it has four major departments: Instrumentation, Digital Imaging, Aerospace and Defense Electronics, and Engineering Systems. It holds industry leadership positions in multiple sub sectors such as environmental monitoring instruments and digital imaging.

Meanwhile, Teledyne Technologies has maintained stable sales and profit growth over the past 20 years, with sustained strong cash flow. The latest market value is about 19.2 billion US dollars, demonstrating its strong financial strength and market value.

In addition to this transaction, Teledyne Technologies and Micropac Industries have also announced that they have reached a final merger agreement, which stipulates that Micropac will merge with Teledyne's wholly-owned subsidiary. Teledyne will acquire all issued and outstanding common shares of Micropac for $20 per share in cash, valuing Micropac at $57.3 million. The transaction is expected to be completed by the end of 2024.

Micropac was founded in 1963, specializing in the design and manufacture of optoelectronic components, sensors and display assemblies, as well as microelectronic products, primarily for military, aerospace, and medical applications.

Source: OFweek

Related Recommendations
  • NSF funding for the world leading EP-OPAL laser multi mechanism design in Rochester

    The National Science Foundation (NSF) of the United States has awarded the University of Rochester nearly $18 million for three years to design and prototype key technologies for EP-OPAL, a new facility dedicated to studying the interaction between ultra-high intensity lasers and matter.After the design project is completed, the facility can be built at the Laser Energy Laboratory (LLE). This fund...

    2023-09-26
    See translation
  • Overview of Residual Stress in Metal Additive Manufacturing: Detection Techniques, Numerical Simulation, and Mitigation Strategies

    Researchers from Shantou University have reported a review of residual stresses in metal additive manufacturing: detection techniques, numerical simulations, and mitigation strategies. The relevant paper titled "A comprehensive review of residual stress in metal additive manufacturing: detection techniques, numerical simulations, and mitigation strategies" was published in the Journal of the Brazi...

    2024-12-20
    See translation
  • Tsinghua University develops efficient and stable perovskite quantum dot deep red light devices

    Semiconductor quantum dots have the advantages of high quantum yield, narrow emission spectrum, and compatibility with solution processes. They have shown broad application prospects and enormous economic value in the field of optoelectronic materials and devices, and related research has won the Nobel Prize in Chemistry in 2023.Compared with traditional II-VI and III-V quantum dots (such as CdSe,...

    03-18
    See translation
  • EV Group launches EVG 850 NanoClean system for ultra-thin chip stacking for advanced packaging

    EV Group, a leading supplier of wafer bonding and lithography equipment in the MEMS, nanotechnology, and semiconductor markets, yesterday launched the EVG850 NanoClean layer release system, which is the first product platform to adopt EVG's revolutionary NanoClean technology.The EVG850 NanoClean system combines infrared lasers with specially formulated inorganic release materials, and can ...

    2023-12-08
    See translation
  • Multinational research team achieves breakthrough in diamond Raman laser oscillator

    Recently, the team led by Professor Lv Zhiwei and Professor Bai Zhenxu from Hebei University of Technology, in collaboration with Professor Richard Mildren from Macquarie University in Australia and Professor Takashige Omatsu from Chiba University in Japan, successfully achieved direct output of Raman vortex optical rotation with large wavelength extension in a diamond Raman laser oscillator. This...

    02-27
    See translation