English

Research Progress: Extreme Ultraviolet Photolithography

194
2024-12-09 14:02:28
See translation

Recently, the semiconductor industry has adopted Extreme Ultraviolet Lithography (EUVL) technology. This cutting-edge photolithography technology is used for the continuous miniaturization of semiconductor devices to comply with Moore's Law. Extreme ultraviolet lithography (EUVL) has become a key technology that utilizes shorter wavelengths to achieve nanoscale feature sizes with higher accuracy and lower defect rates than previous lithography methods.

Recently, Dimitrios Kazazis, Yasin Ekinci, and others from the Paul Scherrer Institute in Switzerland published an article in Nature Reviews Methods Primers, comprehensively exploring the technological evolution from deep ultraviolet to extreme ultraviolet (EUV) lithography, with a focus on innovative methods for source technology, resist materials, and optical systems developed to meet the strict requirements of mass production.

Starting from the basic principles of photolithography, the main components and functions of extreme ultraviolet EUV scanners are described. It also covers exposure tools that support research and early development stages. Key themes such as image formation, photoresist platforms, and pattern transfer were explained, with a focus on improving resolution and yield. In addition, ongoing challenges such as random effects and resist sensitivity have been addressed, providing insights into the future development direction of extreme ultraviolet lithography EUVL, including high numerical aperture systems and novel resist platforms.

The article aims to provide a detailed review of the current extreme ultraviolet lithography EUVL capabilities and predict the future development and evolution of extreme ultraviolet lithography EUVL in semiconductor manufacturing.

 



Figure 1: Basic steps of photolithography process.



Figure 2: Extreme ultraviolet scanner and its main components.



Figure 3: Process window of photoresist.



Figure 4: Contrast curve of chemically amplified resist exposed to extreme ultraviolet light.



Figure 5: Typical faults in photolithography patterning of dense line/spacing patterns and contact hole arrays.



Figure 6: In 2025-2026, with the high numerical aperture, NA systems will enter mass production of high-volume manufacturing (HVM). In the next decade, lithography density scaling will continue to increase.



Figure 7: Chip yield curves plotted as a function of source power divided by dose for high numerical aperture NA and low numerical aperture NA extreme ultraviolet scanners.

Source: Yangtze River Delta Laser Alliance

Related Recommendations
  • Panasonic has announced the launch of two new laser projectors

    Panasonic announced the launch of two new 1-Chip 4K DL laser projectors, the PT-REQ15 projector offering 15,000 lumens of brightness, while its counterpart, the PT-REZ15, offers 15,000 lumens of WUXGA resolution.The REQ15 uses Panasonic's Quad Pixel Drive, a two-axis pixel shift technology, to reproduce 4K images. It is capable of projecting 2K/240Hz content on multiple edge hybrid screens with a ...

    2023-09-07
    See translation
  • FABULOUS provides certified food safety 3D printing materials to the United States

    As is well known, 3D printing is becoming increasingly popular and expanding its application areas to different fields. Additive manufacturing has been established in the aerospace, automotive, and medical industries and is now being used in the production of consumer goods and luxury goods, construction, and food industries. On the one hand, this mainly involves innovative edible products from 3D...

    2024-05-27
    See translation
  • Snapmaker introduces new 20W and 40W laser modules

    Snapmaker has opened pre-orders for 20W and 40W laser modules, which are significant upgrades to the modules available on existing Snapmaker machines.Snapmaker says that with the 40W module installed, you will be able to cut 15 mm basswood plywood at a time at a speed of 20 mm/SEC. With 20W, you will cut 10mm at a rate of 10mm/SEC. That's a lot more than Artisan and Snapmaker 2.0 - both are comp...

    2023-08-04
    See translation
  • DIT and SK Hynix sign KRW 20.52 billion agreement

    Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. According to DIT, the equipment supplied to SK Hynix this time is mainly a laser annealing kit. DIT was founded in 2005 and was listed on KOSDAQ in 2018. Its main focus is o...

    01-20
    See translation
  • Mitsubishi Electric has launched a light source module for high-capacity laser optical communication in outer space

    On August 22nd, Mitsubishi Electric Corporation, a multinational electronics and electrical equipment manufacturing company, announced that it had successfully demonstrated laser optical frequency control using a new light source module, which is a key component of a high-capacity laser optical communication network to be deployed in outer space.It is reported that this module can generate 1.5 &mu...

    2023-08-24
    See translation