- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
On June 24-27, 2025, the global optoelectronic event Laser World of Photonics 2025 was grandly opened in Munich, Germany. This exhibition brings together over 1350 companies from 43 countries, making it the largest in history. Among them, international laser giants Coherent, IPG, TRUMPF, and MKS showcased their latest breakthroughs and future directions in laser technology with multiple heavyweigh...
Additive manufacturing (AM) has made it possible to manufacture complex personalized items with minimal material waste, leading to significant changes in the manufacturing industry. However, optimizing and improving additive manufacturing processes remains challenging due to the complexity of design, material selection, and process parameters. This review explores the integration of artificial int...
With the development of cutting-edge technologies such as automatic guidance and embodied intelligence, machine vision has put forward higher requirements for image acquisition, requiring precise recording of static images and the ability to sensitively capture dynamic changes in the scene. The existing dynamic and active pixel sensor technology integrates two functions: dynamic event detection an...
Lawrence Livermore National Laboratory (LLNL) and the Extreme Light Infrastructure (ELI) European Research Infrastructure Consortium (ERIC) have announced that they have signed a new Memorandum of Understanding. This builds on their existing decade of strategic collaboration to advance high-power laser technology.“We are looking forward to expanding our existing collaborations with ELI on areas su...
The researchers estimate the period from 2023 to 2028. EUV lithography will address the limitations of traditional optical lithography, which has reached its physical limits in terms of resolution. The shorter wavelength of EUV light allows for the creation of smaller features and tighter patterns on silicon wafers, enabling the manufacture of advanced microchips with greater transistor densities....