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EV Group, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, and Silicon Austria Labs, a leading electronic systems research center in Austria, announced that SAL has received and installed multiple EVG lithography and photoresist processing systems in its MicroFab at the R&D cleanroom facility in Filach, Austria.These devices...
Recently, Nuburu, a high-power industrial blue light laser company in the United States, announced that the company has agreed to a new financing arrangement worth up to $65 million.This agreement was reached between Nuburu and the Delaware hedge fund Liquous LP, which claims to provide a "customized liquidity solution". According to the terms of the agreement, Nuburu will first receive an initial...
Recently, HieFo, a leading enterprise in the field of optical communication, officially launched its HCL30 DFB laser chip, designed specifically to meet the stringent requirements of coherent optical transmission. This chip combines efficient optical output power with excellent narrow linewidth performance, providing multiple industry standard wavelength options in the O-band and C-band, bringin...
Dr. Yongcui Mi from Western University in Sweden has developed a new technology that enables real-time laser beam shaping and control for laser welding and directional energy deposition using laser and metal wire. This innovative technology draws on the mirror technology used in advanced astronomical telescopes.Adaptive beam shaping using deformable mirror technology (Image source: Western Univer...
Recently, the High Power Laser Physics Joint Laboratory of Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, proposed a single exposure interferometric calibration method for large aperture diffractive lenses, which provides strong support for the engineering application of large aperture diffractive lenses. The relevant achievements are published in Optics Letters as "...