Türkçe

Acta: Revealing the mechanism of defect formation in additive manufacturing

251
2025-02-21 15:13:01
Çeviriyi gör

Main author: Yanming Zhang, Wentao Yana*
The first unit: National University of Singapore
Published Journal: Acta Materialia

Research background
Industry pain point: Although laser powder bed melting (LPBF) technology can manufacture complex components, the lack of consistent product quality is still the core bottleneck restricting its industrial application. Research has shown that up to 35% of process defects are directly related to powder splashing and entrainment.
Scientific challenge: Traditional experimental methods are difficult to capture microsecond level dynamic processes, and existing numerical models lack accurate descriptions of the gas liquid solid three-phase coupling effect, resulting in unclear mechanisms for defect formation.
Innovation breakthrough point: This study establishes for the first time a CFD-DEM-CALPHAD multi physics field coupling model, breaking through the limitations of traditional simulation methods in modeling phase transition kinetics and metallurgical reactions.

research contents 
Modeling method:
Coupling Computational Fluid Dynamics (CFD) and Discrete Element Method (DEM) to achieve bidirectional coupling between molten pool flow and powder motion
Integrate CALPHAD thermodynamic database to accurately describe metallurgical reactions in multi material systems
Develop a steam jet dynamic model to reproduce the microstructure evolution of Knudsen layer


Figure 1: Schematic diagram of computational domain and mesh.


Experimental verification:
Adopting multiple material systems such as 316L stainless steel and NiTi alloy
Combining high-speed schlieren imaging with ultrafast X-ray observation technology
Build a 4 million grid computing domain, with a single case computation time of 7 days (i9-12900K)


Figure 2: Multiphase flow in the melting process.


Research results
Thermal Splash Dynamics:
70% of the splashing comes from the molten powder in the steam jet zone (Type I)
20% is generated by sudden fragmentation of the molten pool (Type II)
10% from melt pool fluctuations (Type III)


Figure 3: Formation of hot spatters.


Defect formation mechanism:
150 μ m aggregates entering the laser action zone can lead to an 18% increase in porosity
The defect size of Ti particle inclusions in multi material LPBF reaches 45-80 μ m
Splashing momentum changes the flow field at the tail of the molten pool, causing element segregation (Ni segregation degree reaches 62%)


Figure 4: Large agglomeration formed by the coalescence of hot spatters.


Defect criteria:
τ<τc
The critical time τ _c decreases from 157 μ s to 67 μ s as the scanning speed increases


Figure 5: “Chain reaction” of defects induced by large agglomerations.


Deep insight
▶  Technological innovation value:
Establish a fully coupled dynamic model of gas melt pool powder with a resolution of 6 μ m
Revealing the chain reaction mechanism of thermal splashing agglomeration ("defect avalanche" effect)
Propose a prediction criterion for particle inclusion defects based on metallurgical reaction kinetics

▶  Engineering application inspiration:
Developing online monitoring algorithm: implementing defect warning through real-time ratio of τ/τ _c
Optimizing inert gas flow field: controlling the spatial distribution of splashing and redeposition
Multi material process design: Avoiding the combination of liquid-solid phase inversion materials

▶  Current challenges:
The high fidelity model has a high computational cost (single orbit simulation takes 7 days)
The impact of cross airflow on actual working conditions has not been modeled yet
Ultra fine powder (<20 μ m) motion trajectory prediction deviation>12%

▶  Future direction:
Developing GPU accelerated heterogeneous computing framework
Study on the metallurgical behavior of splash matrix interface
Exploring new technologies for controllable utilization of splashes (such as in-situ alloying)

Source: Yangtze River Delta Laser Alliance

İlgili öneriler
  • Luxiner launches LXR platform to set new standards for industrial laser microfabrication

    Luxiner, a globally renowned laser technology leader, proudly launches its latest innovative product, the groundbreaking LXR ultra short pulse laser platform. This cutting-edge technology represents a significant leap in industrial laser processing, providing unparalleled performance, versatility, and reliability.In today's rapidly changing industrial environment, laser technology plays a crucial ...

    2024-03-25
    Çeviriyi gör
  • IPG Q1 revenue of $252 million, co-founder and new CEO of Jiaobang

    Recently, IPG Photonics, a high-performance fiber laser supplier in the United States, released its first quarter financial report as of March 31, 2024.The financial report shows that IPG Photonics revenue in the first quarter was 252 million US dollars, a year-on-year decrease of 27%; The net profit was 19 million US dollars, a year-on-year decrease of 75%. The change in foreign exchange rate res...

    2024-05-07
    Çeviriyi gör
  • Overview of Ultra Short Pulse Laser Processing of Wide Bandgap Semiconductor Materials

    Professor Zhang Peilei's team from Shanghai University of Engineering and Technology, in collaboration with the research team from Warwick University and Autuch (Shanghai) Laser Technology Co., Ltd., published a review paper titled "A review of ultra shot pulse laser micromachining of wide bandgap semiconductor materials: SiC and GaN" in the international journal Materials Science in Semiconductor...

    2024-07-30
    Çeviriyi gör
  • Ultra fast plasma for all optical switches and pulse lasers

    Plasmology plays a crucial role in advancing nanophotonics, as plasma structures exhibit a wide range of physical properties that benefit from local and enhanced light matter interactions. These characteristics are utilized in many applications, such as surface enhanced Raman scattering spectroscopy, sensors, and nanolasers.In addition to these applications, the ultrafast optical response of plasm...

    2024-03-26
    Çeviriyi gör
  • Intel: Has acquired most of ASML's NA extreme ultraviolet lithography equipment in the first half of next year

    According to Korean media reports, Intel has acquired most of the high numerical aperture (NA) extreme ultraviolet (EUV) lithography equipment manufactured by ASML in the first half of next year.ASML plans to produce 5 high NA EUV lithography equipment this year, all of which will be supplied to Intel.They stated that ASML has an annual production capacity of approximately 5-6 High Numerical Apert...

    2024-05-21
    Çeviriyi gör