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Recently, Halo Industries, an innovative technology company based in California, announced that it has successfully raised $80 million in Series B venture capital, marking a significant breakthrough in its use of laser technology to revolutionize the production of silicon carbide (SiC) semiconductor wafer substrates.This financing is led by the US Innovation Technology Fund (USIT) and involves hea...
Recently, optical semiconductor developer Lumiotive, headquartered in Seattle, USA, launched a new LiDAR sensor LM10, which is its first fully produced product of light controlled metasurface (LCM) technology designed for digital beam steering.The developers stated that compared to mechanical systems, their digital beam steering method overcomes the limitations of traditional LiDAR sensors in term...
According to South Korean media etnews, Samsung Electronics and SK Hynix have started the process technology conversion of high bandwidth memory (HBM) wafers, with the introduction of new technologies to prevent wafer warping as the core, which is considered to be aimed at the next generation HBM. It is expected that with the process transformation, the material and equipment supply chain will als...
The high-end laser cutting machine developed and produced by Dongying Lijin Zhancheng Laser Intelligent Manufacturing Company has become popular in overseas markets this spring. This equipment can not only use laser to quickly cut steel, but also freely swing on steel, "showing" beautiful pictures. The laser travels like a paintbrush flying, and the hard steel plate has been hollowed out into be...
Recently, according to Tom's Hardware, Lawrence Livermore National Laboratory (LLNL) in the United States is developing a PW (1015 W) level large aperture thulium (BAT) laser. It is reported that this laser has the ability to increase the efficiency of extreme ultraviolet lithography (EUV) light sources by about 10 times, and may potentially replace the carbon dioxide laser used in current EUV too...