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The National Key Laboratory of Interface Science and Technology for High end Equipment at Tsinghua University has made progress in the field of magnetic field and laser composite processing - magnetic field assisted laser shock strengthening of Ti6Al4V alloy. The relevant research was published as a cover article titled "Magnetic Field Assisted Laser Shock Peening of Ti6Al4V Alloy" in the journal ...
Silicon based quantum chip technology is one of the hot research directions in the field of integrated photonics. Thanks to compatibility with CMOS technology and silicon material characteristics, silicon-based integrated optical chips and devices have many advantages such as low cost, small size, low power consumption, and high integration, providing an ideal platform for large-scale optical comp...
The highly respected Finnish Institute of Geospatial Studies will utilize the advanced LiDAR system developed by the Fraunhofer Institute of Physical Measurement Technology for future ocean surface surveys. Significant progress is expected in data quality and on-site measurement efficiency, and the state-owned research department is collaborating with Fraunhofer IPM on a joint project. They are jo...
Recently, the Italian laser pipe processing group BLM Group announced the launch of an LT-Free five axis laser cutting system that can be used for laser cutting and processing of any three-dimensional metal profile, including bending forming, hydraulic forming, extrusion forming, deep drawing forming, flat or stamped forming of pipe fittings or plates.This five axis laser cutting system can provid...
Sivers Optics, a subsidiary of Sivers Semiconductors, has signed a product development agreement with an undisclosed company.Starting from the initial contract worth $1.3 million, the prototype will be delivered in 2024, and it is expected that the agreement will grow rapidly in 2025 before transitioning to mass production. After entering full production, customers expect the annual chip productio...