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Scientists at the SLAC National Accelerator Laboratory have launched the world's most powerful X-ray laser, which will be used for in-depth atomic and molecular research.It is a significant upgrade to its predecessor, as its brightness has increased by 10000 times.The upgraded laser facility also uses superconducting accelerator components, allowing it to operate at low temperatures near absolute ...
Tescan Group, a high-performance imaging company headquartered in the Czech Republic, has acquired the ultrafast laser specialist FemtoInnovations, in a deal that will also create a new dedicated Laser Technology Business Unit (LTBU) at the University of Connecticut (UConn) Tech Park.“The new unit expands Tescan’s correlative and multimodal portfolio for semiconductor, biomedical device manufactur...
High-tech and industrial laser company Trumpf has reported rather negative preliminary trading figures for the fiscal year (FY) 2024-2025, with CEO Nicola Leibinger-Kammüller stating that “the lowest point has been reached.”The Ditzingen, Germany-based company stated that it had ended the latest fiscal year “as expected – with a decline in sales and order intake.” According to preliminary calcul...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...
The UWBGS program will develop and optimize ultra wide bandgap materials and manufacturing processes for the next revolution in the semiconductor electronics field.US military researchers need to develop new integrated circuit substrates, device layers, junctions, and low resistance electrical contacts for the new generation of ultra wide bandgap semiconductors. They found a solution from RTX comp...