Rachel's latest laser welding and cutting machine processes thicker materials at lightning speed-Chanelink

Unsupervised physical neural network empowers stacked imaging denoising algorithm

In view of the reconstruction problem of stack imaging technology in noisy environment, Lin Nan's team from Shanghai Institute of Optics and Mechanics, Chinese Academy of Sciences, proposed an innovative method ProPtyNet based on unsupervised physical neural network, which is expected to be applied to chip CD measurement and defect detection. The article was published in Optics and lasers in engin...

03-25

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Fundamentals of Next Generation Photonic Semiconductors: Small Lasers

This week, an illustration was published on the cover of the international journal Science, showcasing a powerful mode-locked laser emitted from a miniature photonic semiconductor.A research team led by Alireza Marandi, a professor of electrical engineering and applied physics at the California Institute of Technology, has successfully developed a conventional mode-locked laser large enough to fit...

2023-11-13

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国内自主研发首套碳化硅晶锭激光剥离设备投产

近日，从江苏通用半导体有限公司传来消息，由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司，并投入生产。图：8英寸SiC晶锭激光全自动剥离设备该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片，包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集，一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白，突破了国外的技术封锁，将极大地提升我国碳化硅芯片产业的自主化、产业化水平。该设备年可剥离碳化硅衬底20000片，实现良率95％以上，与传统的线切割工艺相比，大幅降低了产品损耗，而设备售价仅仅是国外同类产品的1／3。近年来，碳化硅功率器件在大功率半导体市场中所占的份额不断提高，并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...

2024-08-26

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The University of California has developed a pioneering chip that can simultaneously carry lasers and photonic waveguides

A team of computer and electrical engineers at UC Santa Barbara, in collaboration with several colleagues at Caltech and another colleague at Anello Photonics, has developed a first-of-its-kind chip that can carry both laser and photonic waveguides. In a paper published in the journal Nature, the team describes how they made the chip and how it worked during testing.With the advent of integrated c...

2023-08-10

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DIT and SK Hynix sign KRW 20.52 billion agreement

Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. According to DIT, the equipment supplied to SK Hynix this time is mainly a laser annealing kit. DIT was founded in 2005 and was listed on KOSDAQ in 2018. Its main focus is o...

01-20

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