- No Data
English
- English
- 简体中文
- 繁体中文
- Français
- Русский
- Italiano
- 日本語
- 한국어
- Português
- Deutsch
- Español
- Türkçe
- Ελληνικά
- Nederlands
- Tiếng Việt
- Polski
On August 14th local time, Veeco Instruments, a well-known American laser annealing manufacturer, announced an important cooperation with technology giant IBM. It is reported that IBM has selected Veeco Instruments' WaferStorm wet processing system as support for its advanced packaging applications, and the two parties have signed a joint development agreement to explore the potential of utilizi...
The new device is a frequency comb - a special type of laser that can generate multiple wavelengths of light, each with a fixed frequency interval. On the spectrogram, it looks a bit like the teeth of a comb. In approximately a quarter century since their first development, these "cursor rulers" have completely transformed various high-precision measurements from timing to molecular detection. In ...
On August 30th, Changguang Huaxin released its results for the first half of 2023. In the first half of this year, the company achieved a revenue of 142 million yuan, a year-on-year decrease of 43.23%; Net profit attributable to shareholders of the listed company -10.6374 million yuan, a year-on-year decrease of 117.97%.Due to macroeconomic factors such as a slowdown in economic growth, market con...
Shijia Photon disclosed its 2024 annual performance forecast on the evening of January 17th, expecting to achieve a revenue of 1.074 billion yuan in 2024, a year-on-year increase of 42.36%; Net profit attributable to the parent company was 65 million yuan, with a loss of 47.55 million yuan in the same period last year; Deducting non net profit is expected to be 48.1 million yuan, with a loss of 66...
Recently, Halo Industries, an innovative technology company based in California, announced that it has successfully raised $80 million in Series B venture capital, marking a significant breakthrough in its use of laser technology to revolutionize the production of silicon carbide (SiC) semiconductor wafer substrates.This financing is led by the US Innovation Technology Fund (USIT) and involves hea...