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The foundation of offshore wind turbines, port protection systems, steel sheet piles, river barriers, water gates, and even pipelines can all be directly processed in water. Another application area is the dismantling of abandoned nuclear reactors, in which case laser technology can gently dismantle steel structures underwater while minimizing the dissolution of radioactive materials.The ocean, wh...
Researchers from the Massachusetts Institute of Technology and the University of Texas at Austin showcased the first chip based resin 3D printer. Their concept verification tool consists of a millimeter sized photon chip that emits a programmable beam of light into resin holes, which solidify into a solid structure when exposed to light.The prototype processor does not have mobile components, but ...
On February 7th, at the Wuhan Semiconductor Laser Equipment Industry Innovation Joint Laboratory located in the HGTECH Technology Intelligent Manufacturing Future Industrial Park, Huang Wei, the technical director of the laboratory and the director of HGTECH Technology's semiconductor product line, gestured with his hands to introduce the principle of "glass through-hole technology" to Changjiang ...
Recently, DIT, a well-known semiconductor and display equipment manufacturer in South Korea, announced that the company has signed an agreement worth 20.52 billion Korean won to supply wafer processing equipment to SK Hynix. After the announcement, DIT's stock price rose for five consecutive days, entering the 16000 Korean won range. Then on the 22nd, it rose 2580 Korean won from the previous day'...
Tool has started pre-sales for the F1 Ultra, a 20 watt fiber and diode dual laser engraving machine. OEMs have stated that it is a win-win product and its so-called "flagship" model.Fiber lasers are mainly used for metal materials and usually work faster than diode lasers, but other materials have better performance when using diode lasers. F1 Ultra aims to bridge this gap by using a power of 20W ...