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On March 14, 2000, Trumpf established its first company in China - Trumpf Metal Sheet Products Co., Ltd., headquartered in Taicang, 50 kilometers northwest of Shanghai. Nowadays, Taicang has become a global strategic stronghold for the company. 25 years ago, this production base was originally used to demonstrate sheet metal processing production for Chinese enterprises. In the seventh year afte...
Researchers from Tsinghua University have summarized the research on ultrafast laser micro nano manufacturing technology, including material processing, surface/interface control, and device manufacturing. The relevant review titled "A Review of Ultrafast Laser Micro/Nano Fabric: Material Processing, Surface/Interface Control, and Device Fabric" was published in Nano Research.Ultra fast laser proc...
With funding from the National Science Foundation of the United States, researchers at the University of Rochester are developing photonic chips that use quantum technology called "weak value amplification" to replace mechanical gyroscopes used in drones, enabling them to fly in areas where GPS signals are obstructed or unavailable.Using this quantum technology, scientists aim to provide the same ...
Chip level ultrafast mode-locked laser based on nanophotonic lithium niobate.Researchers have created a compact mode-locked laser integrated into a nanophotonic platform, capable of generating high-power and ultrafast optical pulses. The breakthrough in miniaturization of MLL technology can significantly expand the application of photonics.Innovation in mode-locked laser technologyTo improve the t...
近日,从江苏通用半导体有限公司传来消息,由该公司自主研发的国内首套的8英寸碳化硅晶锭激光全自动剥离设备正式交付碳化硅衬底生产领域头部企业广州南砂晶圆半导体技术有限公司,并投入生产。 图:8英寸SiC晶锭激光全自动剥离设备 该设备可实现6英寸和8英寸碳化硅晶锭的全自动分片,包含晶锭上料、晶锭研磨、激光切割、晶片分离和晶片收集,一举填补了国内碳化硅晶锭激光剥离设备领域研发、制造的市场空白,突破了国外的技术封锁,将极大地提升我国碳化硅芯片产业的自主化、产业化水平。 该设备年可剥离碳化硅衬底20000片,实现良率95%以上,与传统的线切割工艺相比,大幅降低了产品损耗,而设备售价仅仅是国外同类产品的1/3。 近年来,碳化硅功率器件在大功率半导体市场中所占的份额不断提高,并被广泛应用于新能源汽车、城市轨道交通、风力发电、高速移动、物联网等一系列领域...